Co-fired ceramics were first developed in the late 50’s and early 60′s to make more robust capacitors

Co-fired ceramics were first developed in the late 50’s and early 60′s to make more robust capacitors.^[1] The technology was later expanded in the 60’s to include multilayer printed circuit board like structures.

This technology presents advantages compared to other packaging technologies such as HTCC: the ceramic is generally fired below 1000°C due to a special composition of the material. This permits the co-firing with highly conductive materials (silver, copper and gold). LTCC also features the ability to embed passive elements, such as resistors, capacitors and inductors into the ceramic package minimising the size of the completed module.